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B.Tech & M.Tech VLSI Project & Internship

Internship in VLSI, Btech & MTech project provides candidate in depth exposure to the VLSI domain. This helps candidate with head start in job search after BTech & MTech completion.

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Module 1 Module 2
Training + Placement +
Internship + Certificate
Training + Certificate
6 Months 60 Hours (15 Weeks)
Projects Projects

Fees
₹ 50,000  

Fees
₹ 10,000  

  • VLSI Design Flow (Introduction)
  • Basic Electronics (Resistor, Capacitor, Current & Voltage)
  • Material Physics
  • Mosfet Physics
  • Digital Circuits & Stick Diagrams
  • Linux Comands
  • Small Circuits Simulator using Cadence Tool

  • How to do Layouts
  • Digital Layout Constructions & Verification
  • Analog Layout Construction
  • Matching
  • Shielding
  • EMIR
  • Antenna
  • Latchup
  • Short Channel Effects
  • IC Fabrication
  • Candidates Gets Placement support from this stage

  • Project Execution
  • PLL (Face lock Loop)
  • LDO
  • ADC
  • DAC (Digital to Analog Controls)
  • BGR ( Band Gap Reference)
  • Standard Cell Library Construction

  • Requirements
  • Design specification & architecture
  • RTL Coding
  • RTL integration
  • Functional verification
  • Synthesis
  • DFT
  • Physical Design
  • STA
  • Custom Layout
  • Physical Verification
  • Post Silicon Validation

  • Combinational logic
    • Number systems
    • Radix conversions
    • K-maps, min-terms, max terms
    • Logic gates
    • Realization of logic gates using mux’s and universal gates
    • Compliments (1/2/9/10’s complement)
    • Arithmetic operations using compliments
    • Boolean expression minimization, Dmorgan theorems
    • POS and SOP
    • Conversion and realization
    • Adders
      • Half adder
      • Full adder
    • Subtractor
      • Half subtractor
      • Full subtractor
    • Multiplexers
    • Realizing bigger Mux’s using smaller Mux’s
    • Implementing Adders and subtractors using Multiplexers
    • Decoders and Encoders
    • Implementing Decoders and Encoders using Mux and Demux
    • Bigger Decoder/Encoder using smaller Decoder/Encoder
    • Comparators
    • Implementing multi bit Comparators using 1-bit Comparator
  • Sequential logic
    • Latch, Flipflop
    • Latch, Flipflop using Gates or Mux’s
    • Different types of FFs
    • FF Truth table
    • Excitation tables
    • Realization of FF’s using other FF’s
    • Applications of FF’s, Latches
      • Counters
      • Shift registers
      • Synchronizers for clock domain crossing
      • FSM’s
      • Mealy, Moore FSM
      • Different encoding styles
      • Frequency dividers
      • Frequency multiplication
    • STA
      • Setup time, Hold time, timing closure
      • fixing setup time and hold time violations
      • Launch flop, capture flop

  • Linux/UNIX OS, Shell
  • Working with files, directories
  • Commonly used commands

  • Basic Passive and Active devices.
  • Ohms law, Kirchoff laws
  • Basic of circuit understanding

  • Transistors in hardware design
    • Significance of transistors in hardware design
    • Logic gate implementation using BJT, CMOS
    • MOSFET functionality
  • Semiconductors
    • What makes Semiconductor special element?
    • Classification of solids into three types
    • Conductor, Insulator, Semiconductor
    • Energy bands in Solids
    • Types of Semiconductors
    • Intrinsic Semiconductors
    • Extrinsic Semiconductors
    • Types of Extrinsic Semiconductors
    • N-type Extrinsic Semiconductor
    • P-type Extrinsic Semiconductor
    • Si, Ge – comparison
    • Types of current in Semiconductors – Drift, Diffusion
    • ion
  • PN Junction dioda
    • PN Junction – forward, reverse bias
    • V-I Characteristics of PN Junction Diode
    • Different types of Diode
    • Applications of Diode
  • BJT
    • BJT
    • BJT working principle?
    • How BJT can be used for large scale manufacturing
    • BJT fabrication steps
    • Types of BJT?
    • Why BJT is not used in for lower technology nodes?
    • Issues with BJT?
    • Advantages of BJT?
    • NAND gate using BJT?
  • Field Effect Transistor : FET
    • What is Field Effect Transistor?
    • Types of FET
    • NMOS
    • PMOS
    • CMOS
    • Fin
  • NMOS
    • NMOS
    • What is NMOS?
    • NMOS working principle?
    • Different voltages, currents, their equations
    • NMOS circuit representation
    • How NMOS works like a switch
    • How NMOS can be used for large scale manufacturing
    • NMOS fabrication steps
    • Types of NMOS?
    • Why CMOS is used instead of NMOS?
    • Issues with NMOS?
    • Advantages of NMOS?
    • NAND gate using NMOS?
  • CMOS
    • CMOS
    • What is CMOS?
    • CMOS working principle?
    • Different voltages, currents, their equations
    • CMOS circuit representation
    • How CMOS works like a switch
    • How CMOS can be used for large scale manufacturing
    • CMOS fabrication steps
    • Types of CMOS?
    • Issues with CMOS?
    • Advantages of CMOS?
    • NAND gate using CMOS?
    • CMOS second order effects?
  • FinFET
    • FinFET
    • What is FinFET?
    • FinFET working principle?
    • Different voltages, currents, their equations
    • CMOS circuit representation
    • How CMOS works like a switch
    • How FinFET can be used for large scale manufacturing
    • FinFET fabrication steps
    • Types of FinFET?
    • Issues with FinFET?
    • Advantages of FinFET?
    • NAND gate using FinFET?

  • Layers of CMOS
  • Depositing oxide layer
  • Photholithography
  • Masking
  • Ethching Layers
  • Formation of nwell
  • Self aligned gate fabrication process
  • Diffusion to create n+ and P+ regions
  • Metallization

  • Mismatches & matching
  • Failure mechanisms: Electromigration, IR drop, lod & stress effects, WPE, antenna effects, latch- up, ESD (with high voltage rules, EOS effects)
  • Noises & coupling
  • Different types of processes – advantages & disadvantages:
  • 1. Planar CMOS
    2. FDSOI
    3. SOI
    4. BI-CMOS
    5. Gallium arsenide
    6. Silicon-germanium
    7. Finfet
  • Full chip construction, scribe seal, pad frame, integration, and guidelines
  • Packaging

  • Design rule checks (DRC)
  • Layout versus schematic (LVS)
  • Electrical rule checks (ERC)
  • Antenna checks
  • Latch-up
  • Reliability checks like EM and IR analysis
  • Design for manufacturability (DFM) checks

  • High-speed analog layout
  • Handling clocks
  • Analog circuits & layout guidelines
  • Single & multi-stage differential OP-AMP layout
  • Current mirror layout
  • PLL, DLL, and oscillators
  • Ldo and other regulators
  • ADCS & DACS
  • Bandgap, temperature sensors & biases: Current & voltage bias lines
  • Large drivers
  • Input pair, differential routing, power routing, offset minimizing
  • Power/signal IR drop
  • Cross-talk and coupling
  • Electrostatic discharge (ESD)
  • Deep sub-micron layout issues
  • Shallow trench isolation (STI)
  • Well proximity effect (WPE)

  • Assignments and multiple hands-on projects
  • Best practices & interview questions

  • Floor
  • Planning
  • Schematic
  • Layout

  • AND ALSO

  • Standard cell layout of digital gates
  • Level shifter
  • Schmitt trigger
  • Single stage OP-AMP
  • 4-bit flash ADC
  • 4-bit DAC
  • Bandgap reference with start-up circuit
  • Low drop-out regulator circuit

  • Overview
  • Env Setup
  • Special Variables
  • Data Types
  • Variables
  • Operators
  • Decisions
  • Loops
  • Arrays, Strings, Lists, Dictionary
  • History and Redoing of commands
  • String Pattern Matching commands
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Course Highlights
  • 1-1 Dedicated Mentor Support
  • 24/7 Tool Access
  • Multiple mock interviews
  • Industry Standard Projects
  • Support with resume update